MOSFET Selection Affects Heat Generation

When an I/O module operates under load, insufficient MOSFET current capability or excessive on-resistance can increase power losses and lead to more noticeable heat generation. Therefore, MOSFET selection is an important factor affecting the thermal performance of output modules under load.​

Inductive Loads Create Greater Transient Stress

Solenoid valves and relays are examples of inductive loads. They can generate significant transient stress during startup and switching off. If the MOSFET is selected with insufficient operating margin, power losses and heat generation can become more pronounced when driving these loads.​

Design Margins Improve Output Performance

MOSFET selection should not be based solely on whether the device can switch on. Its voltage rating, current capability, and on-resistance must also be considered. To address these requirements, ULO GROUP I/O modules feature ample voltage margin, additional current headroom, and very low on-resistance, with designs optimized for inductive loads. These features help reduce conduction losses and improve performance under load.​

Heat generation in I/O modules under load is influenced not only by output logic and operating duration but also by MOSFET selection and load characteristics. ULO GROUP focuses on core components and output circuit design, taking voltage ratings, current margins, and inductive load requirements into account to provide reliable I/O output solutions for industrial applications.